Atometrics WM Series Automated 3D Wafer Topography Inspection

$Atometrics-3D Surface Profiler,3D Laser Profiler Sensor, Confocal Laser Displacement Sensor, Film Thickness Instrument, 3D Diffraction Profiler, lmage Dimension Measurement System，Automatic wafer inspection machine，3D automatic measurement equipment for IC substrate$

Chinese

White Light Interference
Roughness Height/height difference 3D Morphology 3D Dimensions 2D Outline 2D size Flatness Film Thickness Perspectives
image Dimension Measurement System
2D size
3D line laser measuring instrument
Height/height difference 3D Morphology 3D Dimensions 2D Outline 2D size Flatness
Spectral confocal displacement sensor
Height/height difference 2D Outline Flatness Thicknesses LocaliZation Oscillation/Vibration Film Thickness
Film thickness gauge FT
Film Thickness
3D Automatic Measuring Equipment
Roughness Height/height difference 3D Morphology 3D Dimensions Film Thickness
Wafer 3D automatic inspection equipment
Roughness Height/height difference 3D Morphology 3D Morphology 2D Outline 2D size
Diffraction 3D Profiler
3D Morphology Height/height difference 2D size Perspectives

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Atometrics WM Series Automated 3D Wafer Topography Inspection

2023-10-12

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Atometrics One-Stop Wafer 3D Inspection Machine WM Series

Suitable for dicing, grinding, thinning, consumables, mask plate, etching, scribing and other applications.

Highly accurate measurement of roughness, step height, grinding pattern, depth of cut, character depth, etc.

Utilizes SST+GAT algorithm to output data quickly and efficiently.

Maximum scanning speed of the measuring unit is up to 400μm/sec, and the platform speed is up to 300mm/sec.

At the same time has a powerful software function, easy to realize the three-dimensional shape of the wafer automatic inspection.